Hermetic Packaging & Feedthroughs
Moisture-tight enclosures and high-pin feedthroughs safeguard active implants
Sealing Electronics for a Lifetime Inside the Body
Hermetic packaging pairs laser-welded metal or ceramic housings with glass-to-metal feedthroughs so power, sensing, and telemetry lines exit an implant without ever letting liquid in. Airtight seals rated as low as 1 × 10-10 atm-cc/sec helium blocks moisture, halts corrosion, and preserves signal fidelity over decades of service in neuromodulators, cardiac rhythm devices, brain-computer interfaces, and implantable pumps. By unifying barrier integrity, biocompatible materials, and dense interconnects in one subsystem, engineers can shrink form factors, add more channels, and accelerate regulatory approvals.
Our Hermetic Packaging & Feedthrough Capabilities
Dive into the core elements Cirtec combines to deliver implant-ready hermetic packages and feedthroughs.
- Optimized laser welding with spot sizes down to 0.0007 in for low heat input and minimal distortion
- Numerous welding technologies to accommodate a variety of metallic and non-metallic materials to match reliability and cost targets
- Multi-axis welding capabilities to ensure robust sealing quality
- Single-pin glass-to-metal and multi-pin feedthrough arrays to >100 channels
- Coaxial, high-voltage, and high-frequency geometries for power, stimulation, or telemetry
- Gold-plated pins and sputtered metallization for low contact resistance
- Helium leak detection to 1E-10 atm-cc/sec, pressure & vacuum cycling, and weld-penetration coupons
- Electrical continuity, insulation resistance, and partial-discharge screening
- CT and X-ray imaging for non-destructive joint inspection
Why Choose Cirtecfor Hermetic Packaging & Feedthroughs?
- End-to-end electronics packaging
- Ultra-low leak-rate validation
- High-density feedthrough arrays
- ISO 13485 & 21 CFR 820 quality
Cirtec unites deep metallurgy, laser processing, and electronic assembly under one ISO 13485 roof. Our engineers co-locate ASIC and electronics design, mechanical design, and hermetic welding so your package, and electronics mature in parallel—shortening V&V timelines.
The result: fewer suppliers, faster design iterations, and decades-long implant performance.
Secure your
implant
technologies
for
decades
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